Sections Dedicated to support more innovative AI applications AI CHIP CENTER FOR EMERGING SMART SYSTEMS Addresses compute, memory, and memory bandwidth scaling problems Computing-in-Memory Architecture for Large-scale AI Models Advancing the field of algorithm-hardware co-design, addressing new challenges arising embodied AI applications Hardware-Software<br>Co-Design for<br>Energy-Efficient and<br>High-Performance Edge AI Focus on supporting the chiplet and 3DIC-based designs, overcoming the limitations of existing EDA tools to enable more agile chip design EDA for Large-Scale AI Hardware Achieve breakthrough performance leaps by leveraging advanced technologies developed Cross-layer Optimization and Demonstration for Targeted Applications Text Area Feature News 2 October 2025 Prof. Fengbin TU Being Named an “Innovator Under 35” Asia-Pacific by MIT Technology Review 24 July 2025 ACCESS Highlights AI Innovations at RISC-V Summit China 2025 18 June 2025 ACCESS Celebrates RAISe+ Funding Success for Groundbreaking AI Chip Research Project
