Sections Dedicated to support more innovative AI applications AI CHIP CENTER FOR EMERGING SMART SYSTEMS Transnational<br>Consortium for R&D<br>on AI Chip Design Addresses compute, memory, and memory bandwidth scaling problems Computing-in-Memory Architecture for Large-scale AI Models Advancing the field of algorithm-hardware co-design, addressing new challenges arising embodied AI applications Hardware-Software<br>Co-Design for<br>Energy-Efficient and<br>High-Performance Edge AI Focus on supporting the chiplet and 3DIC-based designs, overcoming the limitations of existing EDA tools to enable more agile chip design EDA for Large-Scale AI Hardware Achieve breakthrough performance leaps by leveraging advanced technologies developed Cross-layer Optimization and Demonstration for Targeted Applications Text Area Feature News ACCESS Showcases Breakthrough AI Chip Solutions at Hong Kong's Inaugural SIIAS Summit 8 December 2025 ACCESS Showcases Breakthrough AI Innovations at ICCAD Expo 2025 27 November 2025 ACCESS Hosts Dynamic Lab Visit During The Hong Kong Laureate Forum 2025 19 November 2025