We are pleased to announce that Prof. Fengbin Tu, Faculty Researcher of the AI Chip Center for Emerging Smart Systems (ACCESS) cum Assistant Professor from the Department of Electronic and Computer Engineering at The Hong Kong University of Science and Technology (HKUST), and Prof. Yuan Xie, Associate Center Director of ACCESS cum Chair Professor from the Department of Electronic and Computer Engineering, HKUST, have recently been awarded the 2023 Top-10 Research Advances in China Semiconductors for their teamwork on the Reconfigurable Digital Computing-In-Memory AI chip (ReDCIM).
The selection process was highly competitive, involving a committee of 243 experts specializing in semiconductors and integrated circuits. Led by the dedicated research team, the groundbreaking ReDCIM was developed as the world's first CIM-based AI chip with high-precision floating-point and integer support, paving the way to large-scale generative AI computing. The team is closely collaborating with ACCESS for research on high-performance and efficiency AI chip commercialization.
[For details, please click: http://shorturl.at/dwBIP]
The ReDCIM chip was published in the Top-1 journal in integrated circuits, the IEEE Journal of Solid-State Circuits (JSSC, Volume: 58, Issue: 1, January 2023), with the title "ReDCIM: Reconfigurable Digital Computing-In-Memory Processor with Unified FP/INT Pipeline for Cloud AI Acceleration." The paper was first authored by Prof. Tu, with Prof. Xie as the second last author. Congratulations!
[For details, please click: https://ieeexplore.ieee.org/document/9968289]
