Sections Dedicated to support more innovative AI applications AI CHIP CENTER FOR EMERGING SMART SYSTEMS Transnational<br>Consortium for R&D<br>on AI Chip Design Addresses compute, memory, and memory bandwidth scaling problems Computing-in-Memory Architecture for Large-scale AI Models Advancing the field of algorithm-hardware co-design, addressing new challenges arising embodied AI applications Hardware-Software<br>Co-Design for<br>Energy-Efficient and<br>High-Performance Edge AI Focus on supporting the chiplet and 3DIC-based designs, overcoming the limitations of existing EDA tools to enable more agile chip design EDA for Large-Scale AI Hardware Achieve breakthrough performance leaps by leveraging advanced technologies developed Cross-layer Optimization and Demonstration for Targeted Applications Text Area Feature News ACCESS Showcases Breakthrough AI Innovations at ICCAD Expo 2025 27 November 2025 ACCESS Hosts Dynamic Lab Visit During The Hong Kong Laureate Forum 2025 19 November 2025 Professor Tim Kwang-Ting CHENG Honored with Prestigious ACM SIGDA Pioneering Achievement Award 30 October 2025