InnoHK AI Chip Center for Emerging Smart Systems (ACCESS) participated in LEAP East 2026 from 8 to 10 Jul 2026 at the Hong Kong Convention and Exhibition Centre, showcasing its latest research innovations and engaging with stakeholders at the Hong Kong Pavilion, set up by the Innovation, Technology and Industry Bureau (ITIB).
During the event, ACCESS highlighted key R&D achievements, particularly its latest technology “Hardware Accelerator for LLM Edge Computing.” The project based on an application-software-hardware co-design methodology and developed the “AC-Transformer accelerator series”, enabling high-performance, low-power deployment of large-scale AI models in edge environments. The tape-out-ready FPGA prototype runs billion-parameter LLMs with real-time chat efficiency. Licensed to a spin-off for production, the technology supports multimodal edge AI, embodied AI, and robotics. Using 3DIC ReRAM-logic stacking, it cuts key interconnect wires by 80%, boosting performance. Hardware-software co-optimization accelerates ProteinMPNN 7.5x over GPUs, with 14.75x smaller footprint, 235x lower power, 200x lower cost, 25x less carbon, and 1000x better energy efficiency. Applications include drug discovery, enzyme design, and green materials.
The event provided a vital platform for the team to connect with stakeholders and pursue cross-sector and cross-border synergies. Such collaborations are crucial for accelerating the commercial and societal application of research, thereby advancing Hong Kong’s aspirations to become a leading international I&T destination.
About LEAP East 2026:
LEAP East 2026 marked the first LEAP conference held outside Saudi Arabia and the inaugural LEAP East hosted in Hong Kong. The three-day event brought together industry leaders, investors, technology entrepreneurs, and researchers across the Asia-Pacific and Middle East, featuring technology fields including artificial intelligence (AI), deep tech, smart cities, and new energy. The conference attracted more than 35,000 participants, including 340 speakers, 450 exhibitors, and over 400 investors from 30 countries and regions.
