ACCESS Celebrates RAISe+ Funding Success for Groundbreaking AI Chip Research Project

2025-06-18

We are thrilled to announce that the research project “High Energy-Efficient Edge Chip & System for Large AI Models” — led by Prof. C.Y. TSUI, Associate Center Director of AI Chip Center for Emerging Smart Systems (ACCESS) and Professor in the Division of Integrative Systems and Design at The Hong Kong University of Science and Technology (HKUST) — has been awarded funding under the Research, Academic and Industry Sectors One-plus (RAISe+) Scheme by the Innovation and Technology Commission (ITC)!  This achievement celebrates Prof. TSUI and his team’s visionary leadership in revolutionizing energy-efficient AI hardware and system, paving the way for smarter and more powerful computing solutions.

The project is one of seven initiatives from HKUST selected in the second round of the RAISe+ Scheme, solidifying HKUST’s position as the top-performing local institution in this competitive funding program. This achievement reflects HKUST’s leadership in driving impactful research and technological advancement. More details about HKUST’s RAISe+ success: https://hkust.edu.hk/news/hkust-leads-local-institutions-raise-scheme-7-funded-projects.

Join us in congratulating Prof. TSUI and his team on this recognition! We eagerly anticipate their groundbreaking contributions in advancing sustainable, high-performance AI technologies for the future.

About RAISe+ Scheme
Initiated by the government in 2023, the RAISe+ Scheme aims to fund university research teams with strong potential to generate real social impact and market value. To qualify for funding, applicants must demonstrate excellence and distinction in the commercial viability of their project outcomes, as well as their relevance to government policies and community interests, among other areas.  The funding has helped accelerate commercialization of their research discoveries, resulting in a win-win outcome among industry, academia, and research sectors.
 

ACCESS Celebrates RAISe+ Funding Success for Groundbreaking AI Chip Research Project