The AI Chip Center for Emerging Smart Systems (ACCESS) cordially invites you to join the upcoming International Symposium on 3D IC and Heterogeneous Integration to be held on 26 - 28 April, 2022 organized by the Hong Kong University of Science and Technology!
Industry has been trying to integrate much more complex and larger system in a package. However, building larger systems with big, monolithic semiconductors is difficult. 3DIC and Heterogeneous Integration technology can enable building a system with components from different manufacturers. The Symposium will gather brilliant minds from top echelon universities, international academic institutes, and world-leading corporations to share their views on the latest trends, opportunities, and challenges of heterogeneous technologies via 12 lectures and 2 panel discussion sessions with topics as follows:
1. System Architecture & Design in the Era of 3D IC (26 April 2022, Tuesday)
2. 3D IC & M3D (27 April 2022, Wednesday)
3. System-in-Package & Heterogeneous Integration (28 April 2022, Thursday)
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Organizer: |
The Hong Kong University of Science and Technology (HKUST) |
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Co-Organizers: |
Semiconductor Nanotechnology Alliance (SNA) |
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Date: |
26 - 28 April 2022 (HKT, UTC+8) |
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Venue: |
Online via Zoom |
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Free Registration: |
ENROLL NOW! We welcome all interested participants to join the symposium. Don’t miss the opportunity to meet and exchange ideas with the technology giants online!
For latest updates of the event, please visit the symposium website (https://3dichi.hkust.edu.hk/).